Renesas Technology Licenses ParthusCeva's TeakLite DSP Core for Cellular Handsets

Renesas Now Shipping TeakLite GSM/GPRS Chips For Next Generation Cellular Handsets


SAN JOSE, Calif., Sept. 15, 2003 (PRIMEZONE) -- ParthusCeva, Inc. (Nasdaq:PCVA) (LSE:PCV), the leading licensor Digital Signal Processor (DSP) cores and solutions to the semiconductor industry, today announced that Renesas Technology Corp., the world's number one supplier of microcontrollers and the third largest semiconductor company in the world, has licensed ParthusCeva's TeakLite(R) DSP Core. Renesas has commenced shipping GSM / GPRS semiconductor chips powered by ParthusCeva's TeakLite DSP to customers manufacturing next-generation handset products. Renesas was formed in April 2003 by the integration of Hitachi and Mitsubishi Electric semiconductor operations. TeakLite DSP core is optimized for modem devices requiring advanced functionality, and audio processing combined with low-power consumption. The core enables the development of low power handset modems and is an excellent solution for the modem functionality, low-power speech and audio processing required by mobile and communication devices.

"With next-generation applications expanding all the time, ParthusCeva's TeakLite offers a superb low-power and high-performance DSP core platform for chipsets that will continue to meet growing market requirements in the future," commented Mr.Shinji Suda, Department manager, SOC department of Renesas Technology. "GSM / GPRS chipset development was completed on time and in budget and is a testament to our teams abilities to leverage TeakLite's core to build on for the future."

"With Renesas, the third-largest semiconductor in the world, licensing our TeakLite DSP core is further endorsement of our position as the number one licensed DSP architecture in the industry," said Chet Silvestri, CEO of ParthusCeva. "Powered by our TeakLite DSP core, Renesas has produced a wireless solution that leads the industry in performance, power-consumption and feature set and has already been adopted by leading European manufacturers of handsets."

About TeakLite

TeakLite is a 16-bit fixed-point general-purpose licensable DSP core. Designed for low-power and high-performance applications such as cellular handsets, MP3 players, disk drive controllers, cordless, VoIP terminals and various embedded control applications. TeakLite, a fully synthesizable soft core, is a process independent core that is easily portable to any ASIC library.

TeakLite is a member of ParthusCeva's SmartCores(TM) family. These low-power, fixed-point licensable DSP cores offer a range of performance, price and power consumption balances, addressing a wide range of applications, from low-end, high-volume applications, such as digital answering machines, hard disk controllers, low-speed modems and Voice over IP terminals, to high-performance applications such as third-generation (3G) cellular communications, broadband modems, consumer multimedia and Voice over IP gateways. A comprehensive portfolio of software and hardware development tools supports the SmartCores family. In addition, a large network of third-party companies offers applications, tools and design services solutions.

SmartCores licensees benefit from the advanced architecture features, such as:

-- Fully synthesizable soft core that can be ported to any process or foundry

-- Code compatible allowing re-use of legacy code and significantly shorter time to market

-- Low power consumption

-- High code density - to reduce chip cost

-- Cores offered at various performance levels - beginning with single-MAC (OakDSPCore(R) and TeakLite(R)) architecture to Dual-MAC (Teak(R)), Dual-MAC with Instruction Level Parallelism (PalmDSPCore(R)) and the scalable, multiple MAC and extendible architecture of CedarDSPCore.

About Renesas Technology Corp.

Renesas Technology Corp. designs and manufactures highly integrated semiconductor system solutions for mobile, networking, automotive, industrial and digital home electronics markets. Established on April 1, 2003 as a joint venture between Hitachi, Ltd. and Mitsubishi Electric Corporation and headquartered in Tokyo, Japan, Renesas Technology is one of the largest semiconductor companies in the world and world leading microcontroller supplier globally. Besides microcontrollers, Renesas Technology offers system-on-chip devices, Smart Card ICs, mixed-signal products, flash memories, SRAMs and more. http://www.renesas.com

About ParthusCeva

Headquarted in San Jose, ParthusCeva (Nasdaq:PCVA)(LSE:PCV) is the leading licensor of DSP and a leading provider of application-specific platform Intellectual Property (IP) to the semiconductor industry. ParthusCeva was created as a result of the combination of Parthus Technologies plc, a leading provider of application-specific platform IP, and Ceva, formerly the licensing division of DSP Group, the leading licensor of DSP cores.

For more information, visit us at http://www.parthusceva.com.

OakDSPCore, PalmDSPCore, Teak, TeakLite, CedarDSPCore and SmartCores are trademarks and registered trademarks of ParthusCeva, Inc. All other trademarks are the property of their respective owner.

ParthusCeva Safe Harbor Statement

This document contains "forward-looking statements", which are subject to certain risks and uncertainties that could cause actual results to differ materially from those stated. Any statements that are not statements of historical fact (including, without limitation, statements to the effect that the company or its management "believes," "expects," "anticipates," "plans" and similar expressions) should be considered forward-looking statements. Important factors that could cause actual results to differ from those indicated by such forward-looking statements include uncertainties relating to the ability of management to successfully integrate the operations of Parthus and Ceva, uncertainties relating to the acceptance of our DSP cores and semiconductor intellectual property offerings, continuing or worsening weakness in our markets and those of our customers, quarterly variations in our results, and other uncertainties that are discussed in the registration statement on Form S-1and the most recent quarterly report on Form 10-Q of ParthusCeva (formerly called Ceva, Inc.), on file with the U.S. Securities and Exchange Commission.

Contacts:


 ParthusCeva, Inc. 
 Barry Nolan 
 Tel: 1-408-514-2900
  +353-1-4025700

 Media / Ruder Finn 
 Josh Shuman 
 Tel: 212-593-5886 
 shumanj@ruderfinn.com