SCOTTS VALLEY, Calif., May 3, 2005 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that their Carsem-Suzhou factory achieved the ISO9001:2000 Quality Management System (QMS) certification from TUV Rheinland Group, an internationally-accredited quality evaluation company and third party registrar. The factory is a 172K sq. ft. (16K sq. m) facility that is located in the Suzhou Industrial Park, which is in the province of Jiangsu, 50 miles (80 km) west of Shanghai.
ISO 9001:2000 is an international standard that establishes requirements for an organization's QMS. It is part of a family of standards published by the International Organization for Standardization (ISO) often referred to collectively as the "ISO 9000 series." The objective of ISO 9001:2000 is to provide a set of requirements that, when effectively implemented by a supplier, gives customers confidence that their supplier can consistently provide goods and services that meet their needs and expectations and that comply with applicable regulations.
Carsem-Suzhou began shipping production volumes in July 2004 and currently offers full turnkey assembly and test services for the entire range of MLPQ (Quad) and MLPD (Dual) packages, which is a saw-singulated version of QFN & SON compliant packages per JEDEC's MO220 and MO229 standards.
Mr. David Comley, Carsem's Group Managing Director, stated, "The teamwork between the employees of Suzhou and both factories in Malaysia was absolutely outstanding in accomplishing this major milestone in such a short period of time. We expect that, by the end of this year, the Suzhou factory will achieve the same quality certifications currently held by both factories in Malaysia."
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our Malaysian factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, and TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.