SCOTTS VALLEY, Calif., Sept. 8, 2005 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they were selected as austriamicrosystems' primary assembly and test supplier for austriamicrosystems' entire Standard Linear and High Performance Analog product lines for industrial, medical, communications and automotive applications.
According to Mr. Wolfgang Peisser, austriamicrosystems Director of Backend Operations, "We selected Carsem based on their outstanding level of technical support, quality and overall service as well as their test and assembly portfolio that matches our broad range of product needs."
"We have been working very closely with austriamicrosystems over the past several years and we are pleased that Carsem has been selected as the primary supplier for their Standard Linear and High Performance Analog Product lines. We look forward to a continued strengthening of our relationship," stated Liam Noone, Carsem's Director of European Sales.
David Comley, Carsem's Group Managing Director stated, "We are very pleased with austriamicrosystems' decision and the entire Carsem team is fully committed to supporting their needs well into the future."
About austriamicrosystems
austriamicrosystems AG is a leading designer and manufacturer of highly integrated analog intensive ICs. austriamicrosystems combines more than 20 years of design capabilities, product and marketing know-how with its own cutting edge analog manufacturing and test facilities. Operating worldwide with more than 800 employees, austriamicrosystems serves four strategic markets: Communications, Industry & Medical, Automotive and Full-Service Foundry. austriamicrosystems AG is listed on the SWX Swiss Exchange in Zurich (ticker symbol: AMS). Web: www.austriamicrosystems.com
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.