SCOTTS VALLEY, Calif., May 15, 2006 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that they have received ELMOS Semiconductor's Assembly Supplier of The Year Award for 2005. The award is an acknowledgement of significant contributions made during the last year and is based on Carsem's ability to meet ELMOS' commercial, logistic, quality, technology and responsiveness goals.
During a recent ceremony in Ipoh Malaysia, Reinhard Senf, ELMOS Chief Operating Officer, presented the award to S.W. Woo, Carsem Chief Operation Officer.
"ELMOS is pleased to recognize Carsem's ability to respond to the demanding expectations outlined in our supplier performance program. We really appreciate Carsem's commitment to ELMOS," stated Mr. Senf.
"This achievement is the result of a true team effort involving both Carsem and ELMOS Semiconductor. We have been working very closely with ELMOS and look forward to strengthening our relationship," stated Mr. Woo.
Mr. David Comley, Carsem Group Managing Director added, "I am proud that our team received the Assembly Supplier of the Year Award 2005 from ELMOS Semiconductor. This is a direct result of our commitment to working closely with our customers to ensure we offer quality products and services."
About ELMOS Semiconductor
ELMOS Semiconductor AG, with corporate headquarters in Dortmund, Germany, is a leading developer and producer of customer specific system solutions based on semiconductors. For more than 20 years, roughly 90 percent of sales have been achieved with semiconductors for automotive electronics. More information may be obtained by contacting the company directly or by visiting its website at www.elmos.de.
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.