SCOTTS VALLEY, Calif., Aug. 9, 2006 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that they have received SiGe Semiconductor's Assembly Supplier of the Year Award for 2005. The award is based on an exacting supplier rating program that includes key metrics such as on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.
During a recent ceremony at the Carsem facility in Suzhou China, Bill Haberlin, Chief Operating Officer of SiGe Semiconductor, presented the award to T.W. Hee, Carsem Suzhou General Manager.
"We are pleased to present this award to Carsem. They have consistently performed on time and to our desired quality level allowing us to meet the high volume demands of our customers. Carsem will continue to be a valued partner as we proceed with our wireless product roadmap," stated Haberlin.
"This achievement is the result of a team effort involving both Carsem and SiGe Semiconductor. Quality, yield, cycle time, on-time-delivery and customer service are keys to customer satisfaction. This award is a reflection of our dedication to excel in these areas working with our customers. We look forward to strengthening our relationship with SiGe," stated T.W. Hee.
David Comley, Carsem Group Managing Director added, "I am proud that our team received the Assembly Supplier of the Year Award 2005 from SiGe Semiconductor. The Suzhou facility provides us with a tremendous opportunity to meet the huge growth potential in the China market. To receive this award exemplifies our commitment to customer satisfaction and offering leading technology solutions to the industry."
About SiGe Semiconductor
SiGe Semiconductor Inc. is a leading global supplier of RF front-end solutions for next generation wireless systems. Drawing on the unique advantages of silicon germanium technology, the company designs and delivers integrated circuits and chip-scale modules with unparalleled performance and power efficiency. Components from SiGe Semiconductor Inc. can be found in Bluetooth(r)-enabled portable devices, GPS and telematics systems, IEEE 802.11a/b/g/n WLANs, WiMax broadband access equipment and GSM/EDGE and GPRS cellular handsets. For more information, please visit www.sige.com
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the U.S.A., plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.