Carsem Announces Appointment of New General Manager of S-Site in Malaysia


SCOTTS VALLEY, Calif., Jan. 25, 2007 (PRIME NEWSWIRE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that C.S. Lim has joined the company as General Manager of the Carsem S-Site. Mr. Lim will succeed M.H. Toh who left the company in Dec 2006 and reports to S.W. Woo, Carsem's Chief Operating Officer.

Prior to joining Carsem, Mr. Lim was the Assembly Operations Director at National Semiconductor (Melaka). Mr. Lim has over 20 years of experience in the semiconductor industry which includes extensive experience in both assembly and test operations. He has held positions in test, assembly, product engineering, package and process development, and wafer level operations.

S.W. Woo stated, "I am very pleased C.S. Lim has joined our Carsem team. His broad based experience will provide a new dynamic to the future growth of Carsem."

"I am pleased to be a part of the Carsem team and look forward to working to strengthen Carsem's position as a leading provider of turnkey assembly and test solutions," stated Mr. Lim.

About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.


            

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