SUNNYVALE, Calif., Feb. 22, 2008 (PRIME NEWSWIRE) -- Infinera (Nasdaq:INFN) will highlight advances in photonic integration and network design in a series of technical papers, speaking events, demonstrations, and meetings at OFC/NFOEC 2008, the annual trade show and conference for the optical networking industry which runs from Sunday Feb. 24th through Thursday Feb. 28th at the San Diego Convention Center. From Tuesday through Thursday, Infinera will maintain a suite of rooms one level above the trade show floor for meetings with customers and other partners.
Capacity per Chip for Network Scalability
Infinera will unveil its roadmap for photonic integration at OFC, detailing its future plans to increase capacity per chip from today's 100 Gigabits/second (Gb/s) first to 400 Gb/s, and PICs with an aggregate capacity of multiple terabits per chip over time. The key metric for measuring network scalability, capacity per chip is critical for the network to deliver the capacity required to accommodate bandwidth demand growth without increases in cost, complexity, or space and power consumption. For further details, please see today's accompanying news release, Infinera Introduces Roadmap for Photonic Integration. At a briefing for investors, analysts, and media on Wednesday Feb. 27th, 11:30am, Infinera CEO Jagdeep Singh and Chief Marketing and Strategy Officer Dave Welch will discuss Infinera's vision of the future of photonic integration. Those wishing to attend this briefing are asked to contact the Infinera representatives listed below.
Infinera is also announcing the results of two significant lab demonstrations today, which point the way towards the next generation of PICs incorporating advanced modulation architectures and to future optical systems with a potential total fiber capacity of as much as 100 Terabits/second. For further details, please see Infinera news release, Infinera Demonstrates 40G Advanced Modulation on a PIC.
Infinera has partnered with Corning Corporation for a demonstration on the OFC show floor of Infinera's networking systems with Raman amplification technology operating over Corning's latest ULL (Ultra-Low-Loss) fiber. The display demonstrates the combination of two leading technologies to deliver ultra-long reach for single-span applications such as undersea festoon links, as well as the elimination of in-line dispersion compensation. For further details, see the news release dated Feb. 21st entitled Corning and Infinera to Demonstrate Long-Haul Network Design Simplification at OFC/NFOEC 2008.
As a leading optical systems maker that develops and manufactures its own optical components, Infinera engineers and executives will be speaking at the OFC conference on a wide range of issues including both component-level subjects and network subjects. Topics to be explored range from a description of the implementation of phase modulation techniques on photonic integrated circuits to an analysis of how service providers can economize on network capital expenditure by replacing expensive routers with more cost-effective Digital Optical Networking systems. Infinera representatives will speak at the following events at this year's OFC:
Sunday Feb. 24 * 6:20pm. Infinera Director of Optical Systems Steve Grubb will give a workshop talk, Optical vs. Electronic Mitigation Impairment Techniques. Monday Feb. 25 * 8:45am. Ilya Lyubomirsky of Infinera's Advanced Development Group will present a paper, Comparison of 40G DQPSK Flavors for High-Spectral Efficiency Optical Networks. * 9:30 am. OFC Executive Forum, "Four Hot Topics" panel discussion. Infinera Chief Marketing and Strategy Officer Dave Welch will speak on advances in photonic integration. * 4:20pm. Infinera Vice President, Technical Marketing, Serge Melle will present a paper entitled Building Agile Optical Networks. Tuesday Feb. 26 * 1:30pm. Infinera Vice President, Development and Manufacturing, Fred Kish will speak at a book launch for Optical Fiber Telecommunications V, introducing the chapter entitled III-V Photonic Integrated Circuits and Their Impact on Optical Network Architectures, written by members of the Infinera PIC engineering team. * 4:30pm. Steve Grubb and Infinera Director of Optical Component Technology Radha Nagarajan will give a talk entitled Photonic Integrated Circuits with SOAs in WDM Networks. * 5:30pm. Serge Melle will give a talk on Network Cost Savings from Router Bypass in IP-over-WDM Core Networks. Wednesday Feb. 27 * 8:00am. Sanjeev Murthy of Infinera's Photonic Integrated Circuits Group will give a paper on Large-Scale Photonic Integrated Circuit Transmitters with Monolithically Integrated Semiconductor Optical Amplifiers. * 10:00am. Steve Grubb will present a poster entitled Digital Virtual Concatenation Protocol Enables Super-Wavelength 40G Service Transmission over Trans-Oceanic and High PMD Networks. Thursday Feb. 28 * 11:00am. Dave Welch will appear in Panel V of the Market Watch series and speak on Bandwidth Virtualization: Preparing the Network for 100 Gb/s and Beyond.
Individuals wishing to arrange a meeting with Infinera during OFC are invited to contact their Infinera representative.
About Infinera
Infinera provides Digital Optical Networking systems to telecommunications carriers worldwide. Infinera's systems are unique in their use of a breakthrough semiconductor technology: the Photonic Integrated Circuit (PIC). Infinera's systems and PIC technology are designed to provide optical networks with simpler and more flexible engineering and operations, faster time-to-service, and the ability to rapidly deliver differentiated services without reengineering their optical infrastructure. For more information, please visit www.infinera.com.
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This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Infinera as of the date hereof; and actual results could differ materially from those stated or implied, due to risks and uncertainties. Forward-looking statements include statements regarding Infinera's expectations, beliefs, intentions or strategies regarding the future, such as the benefits and capabilities of our products and the Digital Optical Network's architecture, its future plans to increase capacity per chip from today's 100 Gigabits/second (Gb/s) first to 400 Gb/s and PICs with an aggregate capacity of multiple terabits per chip over time, that advanced modulation techniques and future optical systems with a potential total fiber capacity of as much as 100 Terabits/second. Such forward-looking statements can be identified by forward-looking words such as "anticipated," "believed," "could," "estimate," "expect," "intend," "may," "should," "will," and "would" or similar words. The risks and uncertainties that could cause our results to differ materially from those expressed or implied by such forward-looking statements include aggressive business tactics by our competitors, our dependence on a single product, our ability to protect our intellectual property, claims by others that we infringe their intellectual property, our manufacturing process is very complex, product performance problems we may encounter, our dependence on sole or limited source suppliers, our ability to respond to rapid technological changes, our ability to maintain effective internal controls, the ability of our contract manufacturers to perform as we expect, a new technology being developed that replaces the PIC as the dominant technology in optical networks, general political, economic and market conditions and events, including war, conflict or acts of terrorism; and other risks and uncertainties described more fully in our annual report on Form 10-K filed with the Securities and Exchange Commission on February 19, 2008, our public announcements and other documents filed with or furnished to the Securities and Exchange Commission. These statements are based on information available to us as of the date hereof and we disclaim any obligation to update the forward-looking statements included in this press release, whether as a result of new information, future events or otherwise.