Contact Information: FOR INFORMATION CONTACT: Mr. Roger H. Grace President Roger Grace Associates Tel: 239-596-8738 email: Amy Riemer Media Relations - Sensors Expo 978-475-4441
Roger Grace Organizes and Chairs MEMS-Based Systems Solutions Session at Sensors Expo 2009 Chicago
Presentations to Address "Think Outside the Chip"/System Integration Strategies and Applications; Mr. Grace to Present on MEMS Design for Manufacturing/Packaging and Test
| Quelle: Questex Media Group
NAPLES, FL--(Marketwire - May 1, 2009) - Roger Grace, President of Roger Grace
Associates, a high-technology marketing consulting firm specializing in
Micro and Nanotechnology commercialization has organized and will chair a
technical session titled "Think Outside the Chip: MEMS-Based Systems
Solutions" at the Sensors Expo & Conference. In the all-day session on
Monday, June 8, Mr. Grace will be joined by over 20 other world recognized
leaders in the microelectromechanical (MEMS) area representing North
America, Asia and Europe to present information on the partitioning,
integrating and creating of MEMS-based systems and their applications. Mr.
Grace will also make a presentation which will premier his annual MEMS
Industry Report Card and will focus on MEMS design for manufacturing,
assembly and test. The exhibition and technical conference will take place
at the Donald E. Stephens Conference Center in Rosemont, Illinois from June
8-10, 2009.
Mr. Grace stated, "In contrast to the many previous MEMS sessions that I
have developed and chaired at Sensors Expo over the past 20 years which
focused on MEMS from a device perspective, I have created this all-day
session to encourage MEMS developers and users to think outside the chip...
i.e. not about the MEMS device(s) exclusively but rather about the system
solution which can be enabled by MEMS devices. It is well documented and
well known that the typical MEMS device constitutes approximately 25-35% of
the total solution cost of a MEMS-based system. The major cost factors are
the other electronic components which make up the system, the packaging and
test. The object of the session will be to inform the technical, technical
management, and business community about the critical importance of MEMS
system integration issues and tradeoffs as well as the numerous examples of
their far reaching applications from both a current and future
perspective."
"Attendees will be provided with an overview of the issues in creating
MEMS-based system solutions, especially the tradeoffs on selecting signal
conditioning circuits, embedded software, power generation and energy
storage, network communications, interconnects, packaging and testing
functions. We expect the attendee to emerge from the session with a broad
and excellent knowledge of the important factors associated with the
effective selection of system elements and the integration and creation of
a MEMS-based system solution to optimally fulfill their application," Mr.
Grace continued, "We especially desire to encourage and facilitate the
attendees to think outside the chip and to share the benefits of this
approach with their colleagues."
Two internationally recognized experts on the "think outside the chip"
philosophy of MEMS system integration will keynote the session. The morning
keynote titled "Smart System Integration through Micro and
Nanotechnologies," will be given by Dr. Thomas Gessner, Director of the
Fraunhofer Research Institution for Electronic Nano Systems (ENS) of
Chemnitz, Germany. The afternoon keynote titled "Integration Issues and
Tradeoffs for Microsystems: Strategies and Applications" will be given by
Professor Khalil Najafi who is the Assistant Director of the University of
Michigan's Wireless Integrated Microsystems Research Center (WIMS). "Chip"
Spangler of Aspen Technologies will give an invited presentation titled
"Packaging and Assembly Issues for MEMS, Microsystems and Sensors." A panel
discussion of industry pundits will address the topic of "MEMS Design for
Manufacturing, Assembly and Test," which will conclude the session.
The Sensors Expo Technical Conference will take place June 8-10, 2009. The
three-day conference will offer three intensive full-day tutorials, 18
tracks encompassing 55 conference sessions. Topics include energy
harvesting, environmental monitoring, wireless sensor networks, low-power
sensing, fiber optics, smart materials, biodetection and applications. The
two day technical exhibition runs June 9 and 10.
ABOUT ROGER GRACE ASSOCIATES
Roger Grace Associates, founded in 1982, is located in Naples, Florida and
provides comprehensive strategic marketing, strategic communications and
business development services to domestic and overseas
high-technology-based clients. The firm specializes in the
commercialization of technology in the semiconductor, semiconductor
equipment, Nano and MEMS/MST/Micromachine marketplaces.
ABOUT SENSORS EXPO
Sensors Expo & Conference is the leading sensor event in North America
exclusively focusing on sensors and sensor-integrated systems. The
conference program is dedicated to exploring the most up-to-date
innovations in sensor technology including physical sensors, sensor
networks, biosensors, MEMS/Nanotechnology, instrumentation and controls,
intelligent systems, machine-to-machine communication, wireless sensing and
IT technology. Sensors Expo & Conference identifies cutting-edge trends,
explores them in an information-packed conference program and reflects
those trends throughout the exhibit floor with new product announcements,
application presentations, technology focused tours and a showcase of
hundreds of products and services.
Editor's Note: Editors are invited to attend the Sensor Expo Technical
Session as well as the Exhibition free of charge. Please contact Amy
Riemer (amy@riemercommunications.com) to register and request a press pass
and to receive a detailed agenda of the session. Abstracts of the
presentations are available online at http://www.rgrace.com.