Through-Silicon Via Supplier ALLVIA Attains ITAR Registration

SUNNYVALE, CA--(Marketwire - Jul 8, 2011) - ALLVIA, the first through-silicon via (TSV) foundry, has received official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State, Bureau of Political-Military Affairs. The registration certifies the company's dedication as a trusted U.S. facility to adhering to regulations that control the export and import of defense-related products and services.

"We now see the markets for through-silicon via and 3D packaging beginning to expand rapidly and military and defense applications are no exception," commented Sergey Savastiouk, CEO of ALLVIA. "These applications face the same realities of global competition as other technologies: pricing pressure, development time, and OEM efficiencies. With the ITAR registration, ALLVIA is declaring we're ready and able to respond to the most critical criteria for success for these applications."

3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors with silicon interposers than previously possible, leading to a much higher level of electrical performance in integrated circuits.

The Department of State interprets and enforces ITAR. Its goal is to advance national strategic objectives and U.S. foreign policy via the trade controls. For practical purposes, ITAR regulations dictate that information and material pertaining to defense and military related technologies may only be shared with US persons unless approval from the Department of State is received or a special exemption is used.

About ALLVIA

Located in Silicon Valley, ALLVIA is the first Through-silicon via (TSV) foundry and introduced the term "through-silicon via" in both a 1997 business plan and a January 2000 technical article. ALLVIA provides Silicon Interposer and Through-Silicon Via (TSV) foundry services to Semiconductor, Optoelectronics and MEMS industries meeting the demands of advanced vertical interconnects, 2.5D, 3D and System-in-Package (SiP) solutions. www.allvia.com