CHANDLER, Ariz., Feb. 27, 2012 (GLOBE NEWSWIRE) -- Isola Group S.à.r.l., a leading global material sciences company that designs, develops, manufactures and markets copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs) and Circuit Foil Luxemburg S.à.r.l., a manufacturer of high-quality electrodeposited (ED) copper foils, announced today the launch of ultrathin 40 micron laminate. The two companies have jointly developed the product, which will initially be available in high glass-transition temperature (Tg), phenolic-cured resins. The product has a glass-transition temperature in excess of 170 degrees Celsius.
The product is a major improvement over existing technologies, as the laminate is glass reinforced and therefore does not have thermo-mechanical mismatch issues commonly associated with unreinforced films. The mechanical properties, such as the Young's modulus (Tensile Modulus), and thermal expansion coefficient are similar to high-Tg systems, as opposed to a low value of the modulus and high values of thermal expansions typical with ultrathin film. The low modulus and high thermal expansion coefficients of unreinforced products cause interlaminar stresses during the high temperature assembly process leading to delamination issues.
Tarun Amla, Executive Vice President and Chief Technology Officer at Isola Group, stated, "I am pleased to report that Isola, together with Circuit Foil, has overcome the challenges of lower dielectric strength, thickness control and handling associated with the manufacturing of ultrathin, glass-reinforced laminates with a unique technical solution. The dielectric strength of the product will fulfill the growing need in the market for reliable, thinner laminates."
Raymond Gales, Customer Care and Group Quality Director at Circuit Foil, added, "We are very excited with the launch of the product and are looking forward to working with Isola on the next-generation ultrathin laminate and other technologies involving our newest generation of foils with ultraflat profiles."
The product will be marketed and distributed by Isola Group out of its Chandler, AZ facility. For more information, please contact Customer Service at http://www.isola-group.com/contact/ or call 480-812-2511.
About Isola
Isola Group S.à.r.l., headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. The company's high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit http://www.isola-group.com/.
The Isola Group logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=11756
About Circuit Foil
Circuit Foil Luxemburg S.à.r.l. is a global company with a prestigious reputation for manufacturing high-quality ED copper foils for the electronic industry, chip card producers and battery cell manufacturers. With more than 50 years of copper plating knowledge, Circuit Foil provides various ED foil types for a vast number of market segments, including ultraflat profile foils for high-speed/low-loss applications, ultrathin foils for IC packaging, high ductility foils for flexible PCBs, special foils for Li-ion batteries and smart cards. Circuit Foil operates a manufacturing facility in Luxembourg and slitting/sheeting centers in Granby, Canada and Shanghai, China. It has sales offices in Europe, the Unites States and Hong Kong. For more information, visit http://www.circuitfoil.com.