AUSTIN, Texas, May 21, 2012 (GLOBE NEWSWIRE) -- Applied Nanotech Holdings, Inc. (OTCBB:APNT), a global leader in nanotechnology, is pleased to announce that it has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBONDTM for power electronics and photonics applications.
THERCOBONDTM materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability.
"The implementation of new thermal interface composites with a significantly higher level of heat dissipation performance is critical for the extreme requirements of power electronic devices today" said Dr. Nan (David) Jiang, Director of the Thermal Management Division at Applied Nanotech, Inc. "The scope of industrial and commercial applications for THERCOBONDTM materials is immense, starting with electronic packaging, power LEDs, and PCB assembly, just to name a few."
THERCOBONDTM materials can easily be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs.
The first two products in the THERCOBONDTM family are polymer-based (DTC-P) and ceramic-based (DTC-C).
DTC-P is a line of thermally conductive, electrically insulating materials that are based on dielectric polymers modified to maximize thermal conductivity with excellent adhesion and wettability to metals, semiconductors, and graphitic substrates (e.g. CarbAlTM). DTC-P is one-part bonding material and has a working temperature up to 300 oC.
DTC-C is a line of thermally conductive, electrically insulating materials that are based on dielectric ceramics modified to maximize thermal conductivity with excellent adhesion and wettability to semiconductors, and graphitic substrates (e.g. CarbAlTM). DTC-C is one-part bonding material with a low CTE (< 7 ppm/K after curing), and highly heat resistive with a working temperature up to 400 oC.
"With the global market for thermal interface materials projected to be over $600 million by the year 2016, the potential market for THERCOBONDTM materials is very large," said Doug Baker, CEO of Applied Nanotech Holdings, Inc. "The THERCOBONDTM family of products now joins our award-winning thermal management material CarbAlTM and our ultra-strong adhesive CNTstixTM in our growing list of superior performance products based on our nanotechnology innovations. We are well on the way to achieving our commercialization and revenue goals we set for ourselves this year."
ABOUT APPLIED NANOTECH HOLDINGS, INC.
Applied Nanotech Holdings, Inc. is a global nanotechnology leader, focused on solving problems at the molecular level, and commercializing the results of its research. Its team of PhD-level scientists and engineers work with companies and other organizations to solve technical impasses and create innovations that will create a competitive advantage. The business model is to sell products and license patents and technology to partners that will manufacture and distribute products using the technology. Applied Nanotech has over 300 patents or patents pending. Applied Nanotech's website is http://www.appliednanotech.net.
SAFE HARBOR STATEMENT
This press release contains forward-looking statements that involve risks and uncertainties concerning our business, products, and financial results. Actual results may differ materially from the results predicted. More information about potential risk factors that could affect our business, products, and financial results are included in our annual report on Form 10-K for the fiscal year ended December 31, 2011, and in reports subsequently filed by us with the Securities and Exchange Commission ("SEC"). All documents are available through the SEC's Electronic Data Gathering Analysis and Retrieval System (EDGAR) at www.sec.gov or from our website listed above. We hereby disclaim any obligation to publicly update the information provided above, including forward-looking statements, to reflect subsequent events or circumstances.