Cencorp Oyj Stock Exchange Release 29 June 2012 at 16.00 Finnish Time
CENCORP AGREED WITH SAMPO PANKKI OYJ ON AMENDMENT OF FINANCING FACILITIES AND WITH SAVCOR GROUP OY AND SAVCOR INVEST BV ON TRANSFERRING THE LOAN MATURITY DATES
Cencorp has had financing facility agreement amounting totally to EUR four million with Sampo Pankki Oyj. The Agreement’s due date is 30 June 2012. Cencorp has today agreed with Sampo Pankki Oyj on extending the financing facility agreement until 30 Septempber 2012.
In December 2011, Savcor Group Oy and Cencorp agreed on extending the maturity date of a loan of some EUR 1.2 million, granted to Cencorp by Savcor Group Oy in 2009 and converted into a convertible bond on 25 May 2010, until the end of June 2012. Cencorp has agreed with Savcor Group Oy on extending the loan period until 30 September 2012.
Cencorp has a loan of EUR one million from Savcor Invest BV (former AC Invest BV), a daughter company of Savcor Group Oy. In January 2012 the loan period was extended until 30 June 2012 and furthermore Savcor Group Oy committed to extend Cencorp’s loan until April 2013 if Cencorp’s financial situation so requires. Cencorp and Savcor Invest BV have today agreed on transferring the loan’s due date until 30 September 2012. Additionally Savcor Group Oy has renewed its commitment to extend the loan period until April 2013 if Cencorp’s financial situation so requires.
According to available estimates, the company's financing position will continue to be tight. In addition to the measures described above, the company has therefore started discussions with its major financiers and shareholders on measures to strengthen the financing position until the company's cash flow is expected to return to positive.
Mikkeli, 29 June 2012
Cencorp Corporation
Board of Directors
For more information, please contact:
Iikka Savisalo, President and CEO, tel. +358 40 521 6082, iikka.savisalo@savcor.com
Distribution:
NASDAQ OMX, Helsinki
Main media
www.cencorp.com
Cencorp Corporation is a leading provider of industrial automation solutions. The equipment included in the product portfolio designed for depaneling,
odd-form assembly, testing and laser materials processing substantially improves the efficiency of customers' production. The product range also
includes EMI shielding solutions, flexible circuits and RFID antennas. Cencorp's customers are automotive electronics manufacturers and
manufacturers operating in telecommunications, industrial automation and EMS. Cencorp's head office is located in Mikkeli, Finland. The company is part of
the Finnish Savcor Group.