SANTA CLARA, Calif., July 18, 2016 (GLOBE NEWSWIRE) -- Applied Micro Circuits Corporation (NASDAQ:AMCC), a global leader in computing and connectivity solutions, and UTStarcom (NASDAQ:UTSI), a global telecommunications infrastructure provider, today announced that UTStarcom has chosen AppliedMicro’s X-Weave® Smart PHY for UTStarcom’s next generation Packet Optical Transport Solution TN705 platform.
“AppliedMicro’s X-Weave X120 solution enables us to offer our customers a new level of cost effectiveness, agility and scalability that will allow them to address the challenges of today’s telecom and enterprise network market,” said Steven Chen, vice president, product and technology at UTStarcom. “Our solution serves various applications where efficiency, reliability, scalability and availability of telecom carrier-grade features are critical.”
“UTStarcom’s decision to use our X-Weave X120 solution in its TN705 PTN platform further validates our leadership in high speed PHY technology,” said Omar Hassen, associate vice president, connectivity products at AppliedMicro. “AppliedMicro’s X-Weave Smart PHY products deliver up to 240Gbps capacity in a single device and enable high density 100G, 40G and 10G line card solutions.”
X120/X240 Smart PHYs Overview
The family of devices is highly integrated Smart PHY OTN processors with the complete support of OTN framer/mapper features and a rich set of interfaces for 10G, 40G and 100G including 25G/28G CAUI-4/OTL4.4 100G interfaces, XFI/XLAUI/CAUI/OTL3.4/OTL4.10 and Interlaken packet interfaces. The devices also integrate Electronic Dispersion Compensation (EDC), fractional clock synthesis and jitter attenuation phase locked loops (PLLs) that enable the devices to seamlessly interface to a variety of optical and copper interconnections. Besides exceptional performance and flexibility, the devices introduce a new security feature, IEEE802.1AE compliant MACSec for 10GE/40GE/100GE, to address the emerging demands for wire-rate network security in service provider and data center applications.
X12/X120 and X24/X240 are sampling now. For more information, please visit AppliedMicro’s website here.
About AppliedMicro
Applied Micro Circuits Corporation (NASDAQ:AMCC) is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Santa Clara, California. www.apm.com.
About UTStarcom Holdings Corp.
UTStarcom (NASDAQ:UTSI) is a global telecom infrastructure provider dedicated to developing technology that will serve the rapidly growing demand for bandwidth from cloud-based services, mobile, streaming and other applications. We work with carriers globally, from Asia to the Americas, to meet this demand through a range of innovative broadband packet optical transport and wireless/fixed-line access products and solutions. The company’s end-to-end broadband product portfolio, enhanced through in-house Software Defined Networking (SDN)-based orchestration, enables mobile and fixed-line network operators and enterprises worldwide to build highly efficient and resilient future-proof networks for a range of applications, including mobile backhaul, metro aggregation, broadband access and Wi-Fi data offload. For more information about UTStarcom, please visit http://www.utstar.com.
(C) Copyright 2016, Applied Micro Circuits Corporation. AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.