STATS ChipPAC Recognized for Patent Innovations for the Seventh Consecutive Year by IEEE

SINGAPORE -- 23 JANUARY 2017, UNITED STATES--(Marketwired - January 23, 2017) - STATS ChipPAC Pte. Ltd. ("STATS ChipPAC" or the "Company"), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology. This is the seventh consecutive year that STATS ChipPAC has been recognized in the annual scorecards.

The 2016 Patent Power Scorecards are based on objective, quantitative benchmarking of U.S. Patent and Trademark Office records by 1790 Analytics, an Intellectual Property (IP) evaluation firm. The patent portfolios of more than 6,500 leading commercial enterprises, academic institutions, nonprofit organizations, and government agencies worldwide were reviewed through the end of 2015. The scorecards rate the most valuable IP portfolios based on several factors including the size of an organization's patent portfolio, quality, impact, originality and general applicability.

STATS ChipPAC was ranked eighth in the Semiconductor Equipment Manufacturing scorecard, the highest ranking received by an Outsourced Semiconductor Assembly and Test (OSAT) provider for the year. As of the end of 2015, STATS ChipPAC had been granted more than 1,500 patents by the U.S. Patent and Trademark Office (USPTO). STATS ChipPAC has been the leading U.S. patent holder among OSAT providers worldwide since 2011 and has built up a patent portfolio in which advanced or future technologies comprise more than 65% of its IP, significantly higher than other OSATs in the industry.

"Year after year we have continued to focus on technology innovation and prioritized our investments in key areas such as wafer level packaging, flip chip interconnection, System-in-Package (SiP), 2.5D and 3D integration. By driving technology development in these areas, we are able to provide innovative integration solutions that enable our customers to differentiate their products in the marketplace," said Shim Il Kwon, Chief Technology Officer, STATS ChipPAC. "With the combined strength of the JCET Group, we offer our customers an IP portfolio that is unmatched in the OSAT industry."

Forward-Looking Statements

Certain statements in this release, including statements regarding the Company's expectations and intentions relating to the issue of the New Notes and use of proceeds thereof, are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; shortages in supply of key components and disruption in supply chain; disruption of our operations and other difficulties related to the relocation of our China operations; loss of directors, key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; ownership of our ordinary shares by JCET-SC (Singapore) Pte. Ltd. ("JCET-SC"), a special purpose vehicle established for the purpose of acquiring us by a consortium comprising Jiangsu Changjiang Electronics Technology Co., Ltd. ("JCET"), the National Integrated Circuit Industry Investment Fund Co., Ltd. and Semiconductor Manufacturing International Corporation, each of which may have conflicting interests with other holders of our securities; our inability to capture all or any of the benefits from acquisitions and investments in other companies and businesses or from the acquisition of us by JCET-SC; loss of customers or failure to compete effectively with our former Taiwan subsidiaries which we have recently divested; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; and natural calamities and disasters, including outbreaks of epidemics and communicable diseases. STATS ChipPAC does not intend, and does not assume any obligation to update any forward-looking statements to reflect subsequent events or circumstances. References to "$" are to the lawful currency of the United States of America.

About STATS ChipPAC Pte. Ltd.

STATS ChipPAC Pte. Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is a member of the JCET group of companies. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.