Hyderabad, India, March 27, 2017 (GLOBE NEWSWIRE) -- The report “Sputtering Targets & Evaporation Materials Market: By Sputtering Method (DC, Reactive, RF, Others); By Evaporation Method (Thermal, Vacuum, Others); By Material (Pure Metals, Alloys, Compounds); By Application and By Geography- Forecast (2017-2022)”, published by IndustryARC, estimates that the market is set to experience considerable growth in the coming years in APAC region, due to constant demand from dedicated end user sectors, especially electronics, energy, industrial, optical and other technology sectors.
Browse 113 Market Tables, 19 Figures spread through 203 Pages and an in-depth TOC on “Sputtering Targets & Evaporation Materials Market 2017 – 2022”
http://industryarc.com/Report/1305/sputtering-targets-evaporation-materials-market-analysis.html
Scope & Regional Forecast of the Sputtering Targets & Evaporation Materials Market:
Sputtering is a technique whereby a solid target material is bombarded with energetic particles to eject atoms from it and then deposit a thin film on the substrate. Sputtering target and evaporation materials (ST&EM) play a vital role in industries like electronics, energy, optics and others to ensure that a uniform and thin film of desired material is deposited on the substrate to prevent it from external damages. Moreover, sputtering and evaporation are thin film deposition technologies that are most commonly used in semiconductors for diffusion barriers, adhesion or seed layers, etching, antireflection coatings and primary conductors.
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The various methods of sputtering include DC sputtering, reactive sputtering, RF sputtering, Ion assisted, Magnetron and Gas flow. Metals which conduct electricity are sputtered through DC sputtering; whereas, compounds use Reactive sputtering. Moreover, oxides that are insulating can be sputtered by RF sputtering technique but the rate of deposition is low. DC magnetron method is the most commonly used technique in which a magnetic field is provided along with the normal DC method to enhance the quality and efficiency of the deposition. Both Sputtering and evaporation are parts of the physical vapour deposition (PVD).
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Prominent Segmentations Involved in the Sputtering Targets & Evaporation Materials Market:
- Sputtering Method: DC sputtering, sputtering, sputtering, Ion assisted sputtering, Magnetron sputtering, Gas flow sputtering.
- Evaporation Method: Thermal evaporation, Electron-beam evaporation, Vacuum evaporation, Reactive evaporation.
- Material Type: metals, Elemental semiconductors, Alloys, Compounds (oxides, nitrides, sulphides and carbides).
- Application: Electronics, Industrial, Energy, Optics, Others.
- Geographic Regions: North America, Europe, APAC and ROW.
Some of the sample companies profiled in the Sputtering Targets & Evaporation Materials Market report are as follows:
- NV Bekaert
- Shenzhen Hong Rui Xing Sputtering Target Co.,
- China Leadmat Advanced Material Co., Ltd.
- Mosten Alloy Co., Ltd.
- Kessen Ceramics
- Nanjing Muchuan Co., Ltd.
- Shanghai Shuosong Electronic Technology Co.,
- Luvata
- Vacuum Engineering & Materials (VEM)
- Angstrom Sciences
- Quorum Technologies Ltd
- Indium Corporation
- RHP-Technology GmbH
- SAFINA, a.s.
Why buy this report?
- Get a detailed picture of the Sputtering Targets & Evaporation Materials Market.
- Pinpoint growth sectors and identify factors driving change.
- Understand the competitive environment, the market’s major players and leading brands.
- A five-year forecast method is used in order to assess how the market is predicted to develop.
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