Longmont, Colorado, Aug. 21, 2017 (GLOBE NEWSWIRE) -- Lightwave Logic, Inc. (OTCQB: LWLG), a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high-speed fiber-optic data communications and telecommunications, announced today that CEO, Dr. Michael Lebby has accepted an invitation to present to The PIC Conference at the High Technology Campus, Eindhoven, the Netherlands talk on Tuesday, September 26, 2017
The 3rd Annual Photonic Integration Conference is a technical conference that focuses only on PIC based technologies and attracts speakers and companies from all over the world and is attended by senior stakeholders in the integrated photonics value-chain. This year’s conference is located in Eindhoven, The Netherlands.
Dr. Lebby’s invited talk is based on a previously published abstract is entitled, “PICs are Enabling Innovative Products.” can be found at (https://www.phiconference.com/program/). The talk will focus on the explosive growth of integrated photonics both in data centers, telecom networks as well as non-communications applications and will highlight the tremendous market opportunity that lies ahead for both new polymer-based PIC technologies, as well as incumbent technologies such as Indium Phosphide (InP), and platforms such as Silicon Photonics.
Dr. Lebby will discuss Lightwave Logic’s latest results in polymer based PIC technology, and specifically, Lightwave’s advancement of its Mach-Zehnder ridge waveguide modulator designs for 25Gbps and 50Gbps using Polymer PIC platform (P2IC™) technology. The company’s P2IC™polymers system is inherently scalable, electrically efficient and offers an open chemistry development platform that can generate new materials to increase performance without significant incremental cost. The 50Gbs ridge waveguide is the company’s initial foray into Datacom and Telecom and Cloud Computing markets. However, future plans will incorporate P2IC™polymers in ultra-miniaturized silicon organic hybrid devices.
Dr. Lebby noted for this talk, “Our company has again peaked interest from the fiber communications eco-system community, and is being asked to present technical results on our polymer based PIC technology platform. We believe that polymer platform is the solution that can address cost-effective performance scaling of short haul fiber-based communication systems as data rates approach 400Gbps and beyond.
“This conference brings together key stakeholders who are both developing and looking for technology platforms that solve the primary problem that has hampered the ability of the fiber communications eco-system to profitably keep pace with the almost limitless proliferation of data.
Dr. Lebby added, “Our technical team is making terrific progress which is compounding a growing industry awareness and anticipation of a much-needed next-generation technology to replace legacy systems. “
For more information about Lightwave Logic, please visit the Company’s website at www.lightwavelogic.com
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Lightwave Logic, Inc. is a development stage company moving toward commercialization of next-generation photonic devices using its high-activity and high-stability organic polymers for applications in data communications and telecommunications markets. Photonic electro-optical devices convert data from electric signals into optical signals. For more information, about the Company please visit the corporate website at: www.lightwavelogic.com.
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The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A “Risk Factors” in our most recent Form 10-K; other risks to which our Company is subject; other factors beyond the Company's control.
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