C-Bond Systems Receives Notice of Allowance from U.S. Patent and Trademark Office for Seminal Glass Strengthening Patent

U.S. Patent No. 16/376,944 Strengthens C-Bond’s IP Portfolio and the Position of C-Bond nanoShield in the Windshield Strengthening Market


HOUSTON, May 11, 2021 (GLOBE NEWSWIRE) -- C-Bond Systems (the “Company” or “C-Bond”) (OTC: CBNT), a nanotechnology solutions company, announced today that it has received a notice of allowance from the U.S. Patent and Trademark Office for its C-Bond nanoShield™ windshield strengthening solution. This Patent No. 16/376,944, titled “Multipurpose Solution for Strengthening and Surface Modification Of Glass Substrates,” is the seminal patent for C-Bond nanoShield.

Using its proprietary nanotechnology, C-Bond nanoShield protects and strengthens windshields by permeating the glass surface and repairing the microscopic flaws and defects on the glass that ultimately initiate chipping and cracking.

The patent covers a multifunctional composition for modifying one or more surface properties and increasing the strength of the glass substrate, wherein the multifunctional composition is formulated for one-step application to the glass substrate at room temperature and pressure, and wherein the multifunctional composition, when applied to the glass substrate, provides a specified improvement in the strength of the glass substrate as compared to untreated glass, as measured by an industry-standard strength test.

“This new patent not only further strengthens our IP portfolio, but it also validates and protects the underlying technology and advantages of C-Bond nanoShield, which include glass strengthening, hydrophobicity (water run-off), and scratch resistance,” stated Scott R. Silverman, Chairman and CEO of C-Bond. “We have proven our solution for strengthening glass works and now it is even better protected against any potential future competition that may come to market.”

Applying C-Bond nanoShield is simple and quick. It is a spray on, squeegee off process. Strengthening of the windshield begins immediately upon application and continues while the material cures in the following days. The product provides protection from the increasing windshield repair costs associated with advanced driver assistance system (ADAS) sensor technologies

C-Bond’s technology is protected by 22 patents and patent-pending applications.

About C-Bond
C-Bond Systems, Inc. (OTC: CBNT) is a Houston-based advanced nanotechnology company and marketer of the patented and patent-pending C-Bond technology, developed in conjunction with Rice University and independently proven to significantly strengthen glass in key automotive and structural applications. The Company’s Transportation Solutions Group sells C-Bond nanoShield, a liquid solution applied directly to automotive windshields, sold through distributors. The Company’s Safety Solutions Group sells ballistic-resistant glass solutions directly to private enterprises, schools, hospitals, and government agencies. The Company also sells disinfection products, including MB-10 Tablets. For more information, please visit our website: www.cbondsystems.com, Facebook: https://www.facebook.com/cbondsys/ and Twitter: https://twitter.com/CBondSys.

Forward-Looking Statements
Statements in this press release about our future expectations, including the likelihood that our solution for strengthening glass is even better protected against any potential future competition that may come to market; the likelihood that the product provides protection from the increasing windshield repair costs associated with ADAS sensor technologies; constitute "forward-looking statements" within the meaning of Section 27A of the Securities Act of 1933, Section 21E of the Securities Exchange Act of 1934, and as that term is defined in the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve risks and uncertainties and are subject to change at any time, and our actual results could differ materially from expected results. These risks and uncertainties include, without limitation, C-Bond’s ability to raise capital; the Company’s ability to successfully commercialize its products; the effect of the COVID-19 global pandemic on the Company’s and its customers’ ability to operate; the Company’s ability to source materials; the Company’s ability to retain key employees and consultants; as well as other risks. Additional information about these and other factors may be described in the Company’s filings with the Securities and Exchange Commission (“SEC”) including its Form 10-K filed on April 14, 2021, its Forms 10-Q filed on November 16, 2020, August 14, 2020, and May 15, 2020, and in future filings with the SEC. The Company undertakes no obligation to update or release any revisions to these forward-looking statements to reflect events or circumstances after the date of this statement or to reflect the occurrence of unanticipated events, except as required by law.

 

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