Dublin, Jan. 31, 2024 (GLOBE NEWSWIRE) -- The "Global 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Forecast to 2028" report has been added to ResearchAndMarkets.com's offering.
The global 3D Stacking Market is expected to make significant strides with a projected valuation of USD 3.1 billion by 2028, as compared to its current standing at USD 1.2 billion in 2023. This growth, manifesting in a compound annual growth rate (CAGR) of 20.4% from 2023 to 2028, is primarily fueled by the increase in adoption of high-bandwidth memory (HBM) devices and sophisticated electronic integrations within the automotive sector.
With the escalating demand for high-performance computing and energy-efficient Logic Integrated Circuits (ICs), the market is witnessing substantial advancements. 3D stacking methodologies are revolutionizing Logic ICs by amplifying computational efficiency coupled with the minimization of device footprints. This surge in computational capabilities, without having to expand physical space, meets the rising consumer need for faster and dependable electronic devices.
The technological method of hybrid bonding is another propellant driving market expansion due to its promise of enhanced performance and miniaturization in a myriad of electronic applications. Incorporating meticulously prepared pre-bonding layers that lead to strong and reliable wafer fusions post-bond, this trend positions hybrid bonding as an increasingly preferred choice amongst manufacturers.
The 3D Stacking Market is further driven by the need for advanced and compact packaging solutions, particularly within high-performance computing applications. Wafer-to-wafer (WoW) 3D stacking stands out in this realm, enabling systems to achieve augmented performance through reduced interconnect lengths and a boost in system density.
In the geographical landscape, North America is anticipated to hold the second largest market share over the forecast period. This phenomenon can be attributed to the region's host of leading semiconductor corporations and dedicated associations that continually push the envelope in microelectronics and packaging.
Significant Market Participants & Regional Dynamics
The qualitative market landscape is dotted with key players such as Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., and Intel Corporation, among others, which contribute to the geographical and competitive arenas of the 3D stacking sector.
Comprehensive Research and Strategic Industry Vistas
This comprehensive report segments the market based on the method, interconnecting technology, device type, end user, and region. It also encapsulates the driving forces and constraints shaping the market trajectory alongside opportunities for stakeholders.
Key Findings & Market Insights
- Analysis of key drivers such as the push for device miniaturization, cost advantages, soaring consumer electronics demand, heterogeneous integration benefits, and the energy-saving potential of 3D stacking.
- Identification of restraints such as the high initial costs and a lack of standardization across the industry.
- Exploration of opportunities like the growing adoption of HBM devices, expansion of semiconductor applications across various industries, and the integration within automotive electronics.
- Examination of challenges, with a close look at the adoption barriers for both HBM devices and the expansion in semiconductor applications.
Key Attributes:
| Report Attribute | Details |
| No. of Pages | 237 |
| Forecast Period | 2023 - 2028 |
| Estimated Market Value (USD) in 2023 | $1.2 Billion |
| Forecasted Market Value (USD) by 2028 | $3.1 Billion |
| Compound Annual Growth Rate | 20.4% |
| Regions Covered | Global |
Companies Mentioned
- 3M
- Advanced Micro Devices, Inc.
- Amkor Technology
- Applied Materials, Inc.
- Ase Technology Holding Co., Ltd.
- Ayar Labs, Inc.
- Broadcom
- Cadence Design Systems, Inc.
- Cea-Leti
- Cerebras
- Deca Technologies
- Globalfoundries Inc.
- Huawei Technologies Co. Ltd.
- Ibm
- Intel Corporation
- Jiangsu Changdian Technology Co., Ltd.
- Moldex3D
- Monolithic 3D Inc.
- Nhanced Semiconductors
- Powertech Technology Inc
- Qualcomm Technologies, Inc.
- Samsung
- Siliconware Precision Industries Co., Ltd.
- Sk Hynix Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- Teledyne Technologies Incorporated
- Texas Instruments Incorporated
- Tezzaron
- Tokyo Electron Limited
- Tower Semiconductor
- United Microelectronics Corporation
- Xperi Inc.
For more information about this report visit https://www.researchandmarkets.com/r/74bs5v
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