Inapac Teams With e-MDT for Sales and Application Support in Korea
05. November 2007 13:34 ET
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Inapac
SAN JOSE, CA--(Marketwire - November 5, 2007) - Inapac Technology, Inc., a leading provider of
DRAM solutions optimized for system-in-package (SiP) and multi-chip-package
(MCP) devices, today...
Inapac Announces New 32Mb Stacked DRAM Design
16. Oktober 2007 13:24 ET
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Inapac
SAN JOSE, CA--(Marketwire - October 16, 2007) - Inapac Technology, Inc., a leading provider of
DRAM solutions optimized for system-in-package (SiP) and multi-chip-package
(MCP) devices, today...
Mechdyne Enhances Power of PTC(R) Pro/ENGINEER(R) for 3D Design Review
04. Juni 2007 09:00 ET
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Mechdyne Corporation
MARSHALLTOWN, IA--(Marketwire - June 4, 2007) - Mechdyne Corporation, a leading provider
of immersive visualization systems, software and services, today announced
that its Conduit Software module...
Inapac Technology and ProMOS to Collaborate on 256Mb Mobile DDR DRAM for System-in-Package/Multi-Chip Package Applications
30. Mai 2007 13:54 ET
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Inapac
SAN JOSE, CA--(Marketwire - May 30, 2007) - Inapac Technology, Inc. today announced that
it has entered into a development agreement with ProMOS Technologies, a
leading manufacturer of DRAM products,...
Inapac Technology Releases New 16Mb DRAM Design for Mobile Applications That Reduces SiP/MCP Cost
25. April 2007 09:00 ET
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Inapac
SAN JOSE, CA -- (MARKET WIRE) -- April 25, 2007 -- Inapac Technology, Inc., the leading provider
of DRAM solutions for system-in-package (SiP) and multi-chip-package (MCP)
devices, today announced the...
Mechdyne Set to Unveil World's Highest Resolution Immersive Virtual Reality Environment
10. April 2007 09:00 ET
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Mechdyne Corporation
MARSHALLTOWN, IA -- (MARKET WIRE) -- April 10, 2007 -- Mechdyne Corporation and Iowa State
University are making final preparations for the grand opening of the most
impressive virtual reality...
Mechdyne Enables Immersive Virtual Reality Capabilities in Autodesk Maya and 3ds Max
12. März 2007 09:00 ET
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Mechdyne Corporation
MARSHALLTOWN, IA -- (MARKET WIRE) -- March 12, 2007 -- Mechdyne Corporation today announced that
its VRCO software division has expanded the compatibility of its immersive
visualization solution to...
Mechdyne Introduces Transportable Immersive Display System for Trade Events, Command/Control and Traveling Demonstrations
12. März 2007 09:00 ET
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Mechdyne Corporation
MARSHALLTOWN, IA -- (MARKET WIRE) -- March 12, 2007 -- Mechdyne Corporation announced today the
general availability of the Fakespace Mobile FLEX™, a transportable,
immersive display system that...
Inapac Technology Products Selected by Vimicro for Mobile Multimedia Processors
05. März 2007 12:55 ET
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Inapac
SAN JOSE, CA -- (MARKET WIRE) -- March 5, 2007 -- Inapac Technology, Inc. today announced that
Vimicro Corporation (NASDAQ: VIMC), a leading fabless semiconductor company
in China, will begin using...
Mechdyne Announces Visualization Software Extension for Immersive 3D Viewing of Google Earth(TM) Pro
24. Januar 2007 10:00 ET
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Fakespace Systems
MARSHALLTOWN, IA -- (MARKET WIRE) -- January 24, 2007 -- Mechdyne Corporation today announced that
its VRCO software division released Conduit™ for Google Earth™ Pro
4.0, a visualization...