GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform
20. September 2017 13:25 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Sept. 20, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES today announced the availability of its radio frequency/analog PDK (22FDX®-rfa) solution for next-generation wireless and IoT...
GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications
20. September 2017 13:20 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Sept. 20, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES today announced the availability of the industry’s first RF SOI foundry solution manufactured on 300mm wafers. The company’s...
GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX® FD-SOI Platform
20. September 2017 13:15 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Sept. 20, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES today announced the availability of its scalable, embedded magnetoresistive non-volatile memory (eMRAM) technology on the...
GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications
20. September 2017 13:10 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Sept. 20, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES today announced its vision and roadmap for a sweeping range of technology platforms designed to help customers transition to...
GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems
20. September 2017 13:05 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Sept. 20, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES is now delivering in volume its 14nm High Performance (HP) technology that will enable IBM’s next-generation of processors for...
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications
20. September 2017 13:00 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Sept. 20, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES today announced plans to introduce a new 12nm Leading-Performance (12LP) FinFET semiconductor manufacturing process. The...
GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications
09. August 2017 08:00 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Aug. 09, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm...
GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry’s First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles
03. August 2017 08:00 ET
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GLOBALFOUNDRIES
Santa Clara, Calif., Aug. 03, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES and Silicon Mobility today announced they have successfully produced the industry’s first automotive Field Programmable...
GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks
13. Juli 2017 11:00 ET
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GLOBALFOUNDRIES
Santa Clara, Calif. and Shanghai, China, July 13, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES and VeriSilicon today announced a collaboration to deliver the industry’s first single-chip IoT solution...
GLOBALFOUNDRIES®, ON Semiconductor Deliver the Industry’s Lowest Power Bluetooth® Low Energy SoC Family
19. Juni 2017 10:02 ET
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GLOBALFOUNDRIES
Singapore and Santa Clara, Calif., June 19, 2017 (GLOBE NEWSWIRE) -- GLOBALFOUNDRIES and ON Semiconductor (Nasdaq: ON) today announced the availability of a System-on-Chip (SoC) family of devices,...