QP Technologies™ Expands Die Preparation Business
19. Juni 2024 09:00 ET
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QP Technologies
QP Technologies has added new dicing and pick-and-place equipment to expand its wafer and die preparation business.
QP Technologies™ Achieves ANSI/ESD S20.20 Certification
11. April 2024 09:00 ET
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QP Technologies
QP Technologies' Escondido, CA, facility has been certified ANSI/ESD S20.20-compliant, furthering the company's broad commitment to quality and safety.
QP Technologies™ Achieves ISO Certifications from Global Auditing and Certification Body TÜV SÜD America Inc.
28. November 2023 09:00 ET
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QP Technologies
QP Technologies has achieved ISO 9001:2015 and ISO 13485:2016 certifications from standards auditing and certification body TÜV SÜD America.
QP Technologies™ Broadens Microelectronics Plastic-Package Portfolio
16. März 2023 08:00 ET
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QP Technologies
ESCONDIDO, Calif., March 16, 2023 (GLOBE NEWSWIRE) -- QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has extended its broad...
QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
03. Oktober 2022 08:00 ET
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QP Technologies
BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its...
QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs
29. September 2021 09:00 ET
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QP Technologies
ESCONDIDO, Calif., Sept. 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new...
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
16. August 2021 09:00 ET
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QP Technologies
ESCONDIDO, Calif., Aug. 16, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has...
QP Technologies™ Expands Interposer Design Capabilities
29. März 2021 09:00 ET
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QP Technologies
ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced...
Quik-Pak Becomes QP Technologies™
11. März 2021 09:00 ET
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QP Technologies
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and...
Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
06. Oktober 2020 09:00 ET
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Quik-Pak
ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages....