eSilicon to present Mastering SI/PI for Advanced Package Design at the ANSYS Innovation Conference, Santa Clara, California
26. Juli 2018 08:00 ET
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eSilicon
SAN JOSE, Calif., July 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging solutions, will present...
eSilicon at DAC: eSilicon announces new networking platform
19. Juni 2018 08:00 ET
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eSilicon
Presentations Tuesday, June 26 at Chip Estimate Booth 2:00-2:15 PM; Samsung Theatre 3:00-3:15 PM; Mentor Booth 4:00 – 5:00 PM Join us at Stars of IP Party for appetizers, hosted bar, prizes and fun ...
eSilicon trao tặng 07 học bổng cho Nữ sinh hàng đầu khối ngành STEM tại Việt Nam
04. April 2018 18:00 ET
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eSilicon
SAN JOSE, California, Hoa Kỳ và thành phố Hồ Chí Minh, Việt Nam, April 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, nhà cung cấp thiết kế chip ASICs, lõi IP và các giải pháp đóng gói 2.5D...
eSilicon awards seven scholarships to top female STEM students in Vietnam
04. April 2018 18:00 ET
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eSilicon
SAN JOSE, Calif. and HO CHI MINH CITY, Vietnam, April 04, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, has...