NANIUM Extends eWLB to Achieve Higher Reliability
29. Oktober 2013 08:00 ET
|
NANIUM S.A.
VILA DO CONDE, PORTUGAL--(Marketwired - Oct 29, 2013) - NANIUM S.A., Europe's largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an...
STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging
19. August 2013 17:00 ET
|
STATS ChipPAC
SINGAPORE -- 20 AUGUST 2013, UNITED STATES--(Marketwired - Aug 19, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of...
STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone
01. Juli 2013 17:00 ET
|
STATS ChipPAC
SINGAPORE -- 02 JULY 2013, UNITED STATES--(Marketwired - Jul 1, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
STATS ChipPAC Expands in Singapore With Grand Opening of New Building
28. Mai 2013 05:15 ET
|
STATS ChipPAC
SINGAPORE -- 28 MAY 2013, UNITED STATES--(Marketwired - May 28, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
Spreadtrum Adopts STATS ChipPAC's Innovative Packaging for China's Smartphone Market
23. Januar 2013 04:30 ET
|
STATS ChipPAC
SINGAPORE 23 JANUARY 2013, UNITED STATES--(Marketwire - Jan 23, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) (SGX: S24) today announced implementation of breakthrough performance...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
05. November 2012 16:00 ET
|
STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC Expands Manufacturing Presence in Singapore With a New Factory
05. Januar 2012 04:00 ET
|
STATS ChipPAC
SINGAPORE--05/01/2012, UNITED STATES--(Marketwire - Jan 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC's Next-Generation Fan-Out Wafer Level Technology Platform Scales Packaging Solutions for Broader Range of Advanced Applications
05. Oktober 2011 09:30 ET
|
STATS ChipPAC
SINGAPORE--05/10/2011, UNITED STATES--(Marketwire - Oct 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC's Fan-Out Wafer Technology Platform Delivers High Performance, Highly Integrated Solutions in a Wide Range of Package Configurations
31. Mai 2011 13:30 ET
|
STATS ChipPAC
SINGAPORE -- 6/1/2011, UNITED STATES--(Marketwire - May 31, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Celebrates Grand Opening of New 300mm eWLB Manufacturing Facility
15. September 2010 00:15 ET
|
STATS ChipPAC
SINGAPORE--9/15/2010, UNITED STATES--(Marketwire - September 15, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today celebrated the grand opening of its new 300mm...