A larger Hispack seeks to accelerate responsible packaging solutions Hispack 2024 will gather 780 exhibitors and 1,250 brands at Fira de Barcelona's Gran Via venue from May 7 to 10 with a focus on sustainable packaging.

NXP Introduces Secure UWB Fine Ranging Chipset to Allow Broad Deployment in Mobile Devices News Highlights: World’s first all-in-one solution to combine Secure Element (SE), Near Field Communications (NFC) and Ultra-Wide Band (UWB) fine-ranging technologyDelivers unparalleled precision...