SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...

Kandou Bus Closes Series B Investment Round LAUSANNE, Switzerland, July 24, 2018 (GLOBE NEWSWIRE) -- Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M...

Kandou’s Dr. Amin Shokrollahi to Speak about Chord™ Signaling at Design Automation Conference (DAC) LAUSANNE, Switzerland, June 25, 2018 (GLOBE NEWSWIRE) -- Kandou Bus announced today that Dr. Amin Shokrollahi, Founder and CEO of Kandou, will speak at the 2018 Design Automation Conference (DAC) as...

Kandou Announces Availability of Glasswing™ USR SerDes IP LAUSANNE, Switzerland, May 23, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced the introduction of the Glasswing™ USR SerDes, enabling...

Kandou to Demonstrate 500Gbps USR Glasswing PHY at DesignCon 2018 SANTA CLARA, Calif., Jan. 25, 2018 (GLOBE NEWSWIRE) -- Kandou Bus has announced that it will demonstrate its Glasswing™ USR SerDes technology at the DesignCon 2018 Conference, co-host a panel...