BOS1211_finger
Boréas Technologies’ Piezo Driver Chip Advances Realistic Haptic Feedback in Automotive HMIs
07. Januar 2020 08:00 ET | Boréas Technologies
LAS VEGAS, Jan. 07, 2020 (GLOBE NEWSWIRE) -- Boréas Technologies, developer of ultra-low-power haptic technologies for consumer and commercial products, today demonstrated at CES 2020® the BOS1211,...
Boreas1901CW photo 1
Boréas Technologies’ New Chip-Scale Haptic IC Drives HD Touch in Smallest Electronics
04. Dezember 2019 08:00 ET | Boréas Technologies
SEATTLE, Dec. 04, 2019 (GLOBE NEWSWIRE) -- Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its...
SideClik - Sample Open Perspective On with TDK Part number
Boréas Technologies Announces Relationship with TDK Electronics to Advance Touch-Response for Consumer, Automotive, Industrial Markets
14. Mai 2019 11:47 ET | Boréas Technologies
SAN JOSE, Calif., May 14, 2019 (GLOBE NEWSWIRE) -- Boréas Technologies, a developer of ultra-low-power, high-definition (HD) haptic technologies, today announced at Display Week 2019 a collaborative...
BOS1901 Dev-Kit (2)
Boréas Technologies’ Ultra-Low-Power Haptic Chip Solves Power Problem with HD Touch
09. Oktober 2018 07:00 ET | Boréas Technologies
--Boréas device enables realistic haptic feedback without draining battery of mobile products BROMONT, Québec, Oct. 09, 2018 (GLOBE NEWSWIRE) -- Boréas Technologies, developer of...