JCM Global and Techfirm Inc. Sign Memorandum of Understanding to Bring Pay-by-Mobile Phone Technology to Bill Validators
31. Mai 2011 08:00 ET | JCM Global
LAS VEGAS, NV and TOKYO--(Marketwire - May 31, 2011) - Technology development leaders JCM Global (TSE: 6418) (OSE: 6418) and Techfirm Inc. (JASDAQ: 3625) have signed a memorandum of understanding...