STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging SINGAPORE -- 20 AUGUST 2013, UNITED STATES--(Marketwired - Aug 19, 2013) -   STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of...

STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...