SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
30. Oktober 2019 07:00 ET
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Kandou Bus
LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...