ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018 SAN JOSE, Calif., Oct. 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two...

eSilicon to present Mastering SI/PI for Advanced Package Design at the ANSYS Innovation Conference, Santa Clara, California SAN JOSE, Calif., July 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging solutions, will present...

22 Students graduate eSilicon’s FAST Academy work-study program BUCHAREST, Romania, July 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today at...

ASICs Unlock Deep Learning Innovation: Webinar May 2, 2018 SAN JOSE, Calif., April 03, 2018 (GLOBE NEWSWIRE) -- Deep learning applications require extreme performance, low power and high efficiency to effectively process the massive amounts of data used in...

eSilicon Offers Specialty Memory Products on TSMC 28nm and 40nm Processes SUNNYVALE, CA--(Marketwire - Oct 30, 2012) - eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, is now offering memory compilers targeting the...