STATS ChipPAC Announces Volume Manufacturing of fcCuBE(TM) Technology and Expanded Processing Capability for This Advanced Flip Chip Packaging Solution SINGAPORE--09/07/2012, UNITED STATES--(Marketwire - Jul 8, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...