STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...