STATS ChipPAC's Copper Wirebond Shipments Exceed One Billion Units
18. Juni 2012 16:00 ET
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STATS ChipPAC
SINGAPORE -- 19/06/2012, UNITED STATES--(Marketwire - Jun 18, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Ships Over 300 Million Copper Wirebond Units and Expands Fine Pitch Solutions
03. Mai 2011 16:00 ET
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STATS ChipPAC
SINGAPORE--5/4/2011, UNITED STATES--(Marketwire - May 3, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service...