STATS ChipPAC Launches QFN Package Design Kit for Agilent Technologies' Advanced Design System

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced the launch of its Quad Flat No-Lead (QFN) package design kit for Agilent Technologies' Advanced Design System (ADS).

The QFN package design kit (PDK) enhances package modeling and simulation accuracy with Agilent's ADS electronic design automation (EDA) software for radio frequency (RF), microwave and high-speed digital applications for RF semiconductors.

"As RF devices become more compact with increasing design complexities and the integration of multiple integrated circuit (IC) technologies, the accuracy and cycle time required for package modeling and simulation become a critical factor in time-to-market and overall cost. By utilizing the QFN PDK with Agilent's ADS software, our customers will be able to perform fast, accurate simulation in different circuit layout scenarios to achieve first-pass design success. This is increasingly important as RF ICs continue to shrink in dimension and operate at higher frequencies," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. 

"ADS enables IC designers to identify and resolve complex integration issues early in the design process, before the fabrication of wireless components like power amplifiers and RF front-end modules," said Joe Civello, ADS Product Manager for Agilent EEsof EDA. "The combination of STATS ChipPAC's QFN package design kit and our ADS software will provide customers with the information they need to quickly make design decisions to position their RF devices for a successful production ramp."

STATS ChipPAC's package design kit contains models for 3x3, 4x4, 5x5, 6x6, and 7x7 QFN package sizes and was developed for use with ADS 2009 Update 1 and ADS 2011 software in both Windows and Linux versions.

Forward-Looking Statements
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About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.