Lightwave Logic CEO Dr. Michael Lebby Invited to Present to the PIC International Conference in Brussels, Belgium on April 11, 2018

Dr. Lebby to update Lightwave Logic's progress with 50 Gbps polymer modulator solution designed for fiber-based data communications applications at 400 Gbps and beyond

Englewood, Colorado, April 02, 2018 (GLOBE NEWSWIRE) -- Lightwave Logic, Inc. (OTCQB: LWLG), a technology company focused on the development of Next Generation Photonic Devices and Non-Linear Optical Polymer Materials Systems for applications in high-speed fiber-optic data communications and telecommunications, announced today that CEO, Dr. Michael Lebby has accepted an invitation to present to the PIC International Conference in Brussels, Belgium, on Wednesday April 11, 2018.

This is the 3rd International PIC conference which brings together Photonic Integration technologists from all over the world and attracts speakers from companies that purchase photonics for their networks and architectures in need of immediate technological solutions to scale their systems.  The conference also draws stakeholders such as foundries, tool suppliers and technologists that support PIC based technologies for both fiber communications as well as other applications.     

Dr. Lebby’s invited talk will be based on a previously published abstract is entitled, Scalable PIC platforms: The impact of Using Polymer PICs for 100 and 400 Gbps Datacom Applications. It will focus on the fast growth of integrated photonics both in data centers, telecom as well as non-communications applications and also explore the increased growth being driven by new opportunities for scalable PIC platforms.

Dr. Lebby will show the increased data-rates, scalability and lower cost structures that Lightwave Logics’ polymer-based PICs will offer based on 50 Gbps data rates and also provide an update on the World Photonics Roadmap process to explain how 50 Gbps polymer-based PICs can positively impact the data communications community.

The conference agenda can be found at the following URL:

Additionally, Dr. Lebby will present Lightwave Logic’s latest results of its polymer-based PIC technology-- specifically, Lightwave’s advancement of its Mach-Zehnder ridge waveguide packaged-modulator designs for 50 Gbps operation using a polymer PIC platform (P2IC™) technology. 

Dr. Lebby noted, “To be invited at the world’s largest and most prestigious PIC conference is an honor, but also an opportunity for Lightwave Logic to show our high-performance 50 Gbps polymer modulator platform and how it will positively impact data interconnects in the fiber data communications market.  Our world-class technical team has made excellent progress over the past year and has developed new technology that will enable advanced PIC performance. 

For more information about Lightwave Logic, please visit the Company’s website at:

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Lightwave Logic, Inc. is a development stage company moving toward commercialization of next generation photonic devices using its high-activity and high-stability organic polymers for applications in data communications and telecommunications markets. Photonic electro-optical devices convert data from electric signals into optical signals. For more information, about the Company please visit the corporate website at:

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The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A “Risk Factors” in our most recent Form 10-K; other risks to which our Company is subject; other factors beyond the Company's control.


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