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SAN JOSE, Calif., May 28, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today that two of its...
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SAN JOSE, Calif., May 15, 2019 (GLOBE NEWSWIRE) -- eSilicon CEO Jack Harding will comment on the state of the application-specific integrated circuit (ASIC) market. What ESD Alliance CEO Outlook...
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SAN JOSE, Calif., May 14, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today that a large 2.5D...
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SAN JOSE, Calif., May 09, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a...
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SAN JOSE, Calif., May 08, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will discuss its 14nm...
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SAN JOSE, Calif., May 07, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a...
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SAN JOSE, Calif., May 01, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a...
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SAN JOSE, Calif., April 30, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the addition of...
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SAN JOSE, Calif., April 29, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of...
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SAN JOSE, Calif., and HO CHI MINH CITY, Vietnam, April 03, 2019 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, awarded...