QP Technologies™ Achieves ISO Certifications from Global Auditing and Certification Body TÜV SÜD America Inc.
November 28, 2023 09:00 ET
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QP Technologies
QP Technologies has achieved ISO 9001:2015 and ISO 13485:2016 certifications from standards auditing and certification body TÜV SÜD America.
QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
October 03, 2022 08:00 ET
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QP Technologies
BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its...
QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs
September 29, 2021 09:00 ET
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QP Technologies
ESCONDIDO, Calif., Sept. 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new...
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
August 16, 2021 09:00 ET
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QP Technologies
ESCONDIDO, Calif., Aug. 16, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has...
QP Technologies™ Expands Interposer Design Capabilities
March 29, 2021 09:00 ET
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QP Technologies
ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced...
Quik-Pak Becomes QP Technologies™
March 11, 2021 09:00 ET
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QP Technologies
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and...
Quik-Pak Relocates to Larger, Customized Facility
April 07, 2020 09:00 ET
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Quik-Pak
ESCONDIDO, Calif., April 07, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, a provider of innovative microelectronic packages, assembly and wafer-processing solutions, today announced it has relocated all...
Quik-Pak Announces Substrate Development Service
February 11, 2020 09:00 ET
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Quik-Pak
SAN DIEGO, Feb. 11, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced its substrate design, fabrication and assembly...