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September 14, 2023 09:23 ET | Source: Research and Markets

Diamond Slurry SiC Wafer Polishing Centrifuges Lead Growth in Global SiC Wafer Polishing Market with 37.5% CAGR to 2028

Dublin, Sept. 14, 2023 (GLOBE NEWSWIRE) -- The "Global SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application,...
March 31, 2011 15:00 ET | Source: NexPlanar

NexPlanar Secures $10 Million for Capacity Expansion of Semiconductor CMP Pad Technology

HILLSBORO, OR--(Marketwire - March 31, 2011) - NexPlanar Corporation recently completed a $10.0 million round of Series D funding to expand production capacity both in the U.S. and to strategic...
March 08, 2011 11:15 ET | Source: NexPlanar

New NexPlanar CTO to Lead Advanced CMP Pad Product Development

HILLSBORO, OR--(Marketwire - March 8, 2011) - NexPlanar, the semiconductor CMP pad technology company, has tasked its recently hired CTO, Rajeev Bajaj, with expanding on the core capabilities of...