Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs
December 05, 2024 09:00 ET
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Broadcom Inc.
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology,...