SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
October 30, 2019 07:00 ET
|
Kandou Bus
LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...
Kandou Bus Closes Series B Investment Round
July 24, 2018 08:00 ET
|
Kandou Bus
LAUSANNE, Switzerland, July 24, 2018 (GLOBE NEWSWIRE) -- Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M...
Kandou’s Dr. Amin Shokrollahi to Speak about Chord™ Signaling at Design Automation Conference (DAC)
June 25, 2018 16:38 ET
|
Kandou Bus
LAUSANNE, Switzerland, June 25, 2018 (GLOBE NEWSWIRE) -- Kandou Bus announced today that Dr. Amin Shokrollahi, Founder and CEO of Kandou, will speak at the 2018 Design Automation Conference (DAC) as...
Kandou Announces Availability of Glasswing™ USR SerDes IP
May 23, 2018 07:00 ET
|
Kandou Bus
LAUSANNE, Switzerland, May 23, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced the introduction of the Glasswing™ USR SerDes, enabling...
Kandou to Demonstrate 500Gbps USR Glasswing PHY at DesignCon 2018
January 25, 2018 11:15 ET
|
Kandou Bus
SANTA CLARA, Calif., Jan. 25, 2018 (GLOBE NEWSWIRE) -- Kandou Bus has announced that it will demonstrate its Glasswing™ USR SerDes technology at the DesignCon 2018 Conference, co-host a panel...