Latest News and Press Releases

Want to stay updated on the latest news?

Sign into Reader Account Create Reader Account

April 30, 2026 05:39 ET | Source: SCHMID Group N.V.

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
November 10, 2025 06:20 ET | Source: SCHMID Group N.V.

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

SCHMID Group wins major PLP & mSAP equipment orders in Asia, strengthening its role in advanced PCB & IC-substrate manufacturing amid surging AI demand.
October 22, 2025 07:31 ET | Source: SCHMID Group N.V.

SCHMID Group secures Major Orders for AI Server PCB Production Equipment

SCHMID Group wins two major PCB orders for AI server applications, delivering full production lines with V+ and H+ systems to drive AI hardware growth.