Latest News and Press Releases

Want to stay updated on the latest news?

Sign into Reader Account Create Reader Account

March 19, 2024 08:02 ET | Source: Deca Technologies

Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging

Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.