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June 09, 2026 16:00 ET | Source: ROHM Semiconductor

ROHM launches New Top-Side Cooling Package for SiC MOSFETs

Santa Clara, CA and Kyoto, Japan, June 09, 2026 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced it has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a...