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November 10, 2025 06:20 ET | Source: SCHMID Group N.V.

SCHMID Group secures major orders for Panel Level Packaging (PLP) and modified-Semi-Additive (mSAP) production equipment

SCHMID Group wins major PLP & mSAP equipment orders in Asia, strengthening its role in advanced PCB & IC-substrate manufacturing amid surging AI demand.
January 21, 2025 10:00 ET | Source: Precedence Statistics

Panel Level Packaging Market to Attain USD 11.13 Bn by 2033

Ottawa, Jan. 21, 2025 (GLOBE NEWSWIRE) -- The global panel level packaging market size to calculate USD 11.13 billion by 2033, up from USD 0.59 billion in 2024, expanding at a CAGR of 38.60% from...