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Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
December 06, 2023 08:00 ET | Microchip Technology Inc.
CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume manufacturing. To better automate the...
ROHM introduces the industry's thinnest 12W rated metal plate shunt resistor
ROHM Introduces Ultra-Low-Profile, 12W Rated Metal Plate Shunt Resistor, Ideal for Double-Sided Cooled Power Modules in Automotive and Industrial Equipment
April 27, 2023 17:00 ET | ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, April 27, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the industry’s thinnest[1] (H: 0.03-inch) 12W rated metal plate shunt resistor (PSR350),...
ROHM Semiconductor & Semikron Danfoss Announce Partnership
Partnership for True Multiple Sourcing: ROHM IGBTs with Semikron Danfoss Power Modules
April 25, 2023 17:00 ET | ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, April 25, 2023 (GLOBE NEWSWIRE) -- Kyoto-based ROHM Semiconductor and Semikron Danfoss have been collaborating for more than ten years with regards to the...
ROHM’s SiC MOSFETs and SiC SBD in a new line of power modules from Apex
Bare Die SiC from ROHM Chosen by Apex Microtechnology for Newest Line of Power Modules
March 20, 2023 17:00 ET | ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, March 20, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced that precision power analog company Apex Microtechnology is adopting ROHM’s silicon carbide...
ROHM, Mazda, and Imasen Joint Agreement
ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters for e-Axle Using ROHM SiC Power Modules
November 22, 2022 17:00 ET | ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Nov. 22, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced they have signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen...
Signing of the joint venture agreement on October 1, 2021
Zhenghai Group and ROHM Agree to Establish a Joint Venture in the SiC Power Module Business
October 27, 2021 17:00 ET | ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Oct. 27, 2021 (GLOBE NEWSWIRE) -- Zhenghai Group Co., Ltd. (Zhenghai Group) and ROHM Co., Ltd. (ROHM) have signed a joint venture agreement to establish a new...
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Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
September 20, 2021 08:05 ET | Microchip Technology Inc.
CHANDLER, Ariz., Sept. 20, 2021 (GLOBE NEWSWIRE) -- As demand for electric buses and other electrified heavy transport vehicles increases to meet lower emission targets, silicon carbide-based power...
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First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
August 03, 2021 08:05 ET | Microchip Technology Inc.
CHANDLER, Ariz., Aug. 03, 2021 (GLOBE NEWSWIRE) -- In the race to reduce aircraft emissions, developers increasingly are moving toward more efficient designs including electrical systems that...
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Microchip Boosts Gallium Nitride (GaN) Radio Frequency (RF) Portfolio with Ka-band Monolithic Microwave Integrated Circuit (MMIC) with High Linearity for SatCom Terminals
June 21, 2021 08:01 ET | Microchip Technology Inc.
CHANDLER, Ariz., June 21, 2021 (GLOBE NEWSWIRE) -- Satellite communication systems use complex modulation schemes to achieve the blazingly fast data rates required to deliver video and broadband...
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Global power MOSFET Market to Generate $9.90 billion by 2027: AMR
March 09, 2021 10:00 ET | Allied Market Research
Portland.OR, March 09, 2021 (GLOBE NEWSWIRE) -- According to the report published by Allied Market Research, the global power MOSFET market garnered $5.43 billion in 2019, and is estimated to...