BEVERLY, Mass., and BILTHOVEN, the Netherlands, July 17, 2001 (PRIMEZONE) -- Axcelis Technologies, Inc. (Nasdaq:ACLS), and ASM International N.V. (Nasdaq:ASMI) (Euronext Stock Exchange in Amsterdam:ASM) today announced that the companies will be working together to further develop dry strip methods for removing photoresist over advanced low-k dielectric materials.
The joint development program is aimed at accelerating the integration and adoption of these low-k materials into IC manufacturing processes. Chipmakers are now rapidly adopting low-k dielectrics to produce devices with 0.13-micron and below geometries.
Axcelis and ASM will seek to demonstrate optimized downstream plasma resist strip processes, performed in Axcelis' tools over ASM's Aurora(tm) low-k films, deposited in the ASM Eagle(r) PECVD tools. The work is expected to lead to a cost-effective, damage-free resist strip process for Aurora low-k materials.
"By working together, ASM and Axcelis are resolving one of the more significant low-k integration challenges facing our customers -- that is, how to remove resist, while maintaining the high quality of the low-k material itself," said Ivo Raaijmakers, chief technology officer for ASM. "As Aurora(tm) 2.7 rapidly gains acceptance for the 130 nm and below device generations, customers need a low-cost, easy-to-integrate resist strip method. This partnership will build on Axcelis' leadership in non-damaging resist strip to produce an optimal resist removal process for ASM's low-k materials and will enable us to achieve quicker qualification in our customers' low-k dielectric integration schemes."
Under the planned agreement, the companies also intend to extend the process development work to ASM's next-generation ultra low-k materials using Axcelis' enhanced strip technologies. The optimized resist strip processes will be developed using Axcelis' advanced 300mm toolsets, the FusionES3 and the recently released Axcelis FusionES3i plasma ashers. The Aurora low-k dielectrics will be deposited in the ASM Eagle(r) 10, Eagle(r) 10 / Trident(tm) and the 300 mm Eagle(r) 12 / Rapidfire(tm) PECVD tools.
"The industry's current method for removing resist over low-k involves the use of a reactive ion etch process, which is a solution with high cost-of-ownership. Through this partnership, we can offer a superior low-k resist strip method with significantly lower cost of ownership," said Michael Dreyer, vice president and general manager of Axcelis' photoresist processing group. "ASM brings a broad knowledge of both front- and back-end manufacturing issues associated with the integration of low-k materials. Our combined expertise will be key to ensure the successful integration of our resist strip processes. This is another example of our commitment to leadership in strip over low-k process technology and is part of our strategy to provide a complete solution across a full spectrum of low-k integration scenarios for our customers," said Dreyer.
About ASM International N.V.
ASM International N.V. is headquartered in Bilthoven. ASM International is a global company, serving one of the most important and demanding industries in the world. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network. ASM International's subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging through their facilities in the United States, Europe, Japan and Asia. ASM International's common stock shares trade on Nasdaq (symbol ASMI) and the Euronext Stock Exchange in Amsterdam (symbol ASM). For more information, visit ASM's Website at http://www.asm.com.
About Axcelis Technologies, Inc.
Axcelis Technology, Inc., headquartered in Beverly, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high-energy ion implantation equipment; rapid thermal processing systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as Toyo, Japan -- through its joint venture Sumitomo Eaton Nova. The Company's Internet address is http://www.axcelis.com
Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: The statements regarding the expectations of Axcelis and ASM for the joint development project discussed in this statement are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. In this case, the expectations of Axcelis and ASM regarding the joint venture are subject to the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with each other and with major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic and financial conditions. These risks and other risk factors relating to Axcelis and ASM are described more fully in the most recent Form 10-K filed by Axcelis and the most recent Form 20-F filed by ASM and in other filings from time to time with the Securities and Exchange Commission.
ASM is a registered trademark of ASM International.