SCOTTS VALLEY, Calif., March 21, 2007 (PRIME NEWSWIRE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they have received Richtek's Assembly Supplier of The Year Award for 2006. The award is based a rating system which rates and monitors performance in areas such as on-time-delivery, cycle time, customer service, quality, competitiveness, responsiveness and technology.
During a recent ceremony at Richtek's annual dinner in Hsinchu Taiwan, Luke Hsieh, President and CEO, presented the award to Albert Law, Carsem's Director of Asian Sales and Max Lee , Carsem's Account Manager in Taiwan.
"Carsem's service and support has enabled Richtek to maximize its new products potential. Their performance enabled us to meet our time-to-market goals and achieve our 2006 business objectives. This award is to acknowledge their support and the close working relationship between Carsem and Richtek which will benefit both companies as we grow in the marketplace," stated Mr. Hsieh.
"This achievement is the result of a true team effort involving both Carsem and Richtek. I would like to thank our Carsem Suzhou Team for their hard work and dedication in the support of a key customer. We look forward to building a strong relationship with Richtek moving forward," stated Mr. Law.
Mr. David Comley, Carsem Group Managing Director added, "I am proud that our Carsem Suzhou Team received the Assembly Supplier of the Year Award 2006 from Richtek. This is a direct result of our commitment to working closely with our customers to ensure we offer quality products and services to the industry."
About Richtek
Founded in 1998, Richtek Technology Corporation is an analog IC design company, composed of experienced, professional, and innovative technologists. Since our start in 1998, Richtek not only delivers a new generation of cost-effective power management ICs, but also provides clients with customized system design-in services and support. Richtek is a "power partner". We play an active role in the integration of cutting-edge power management solutions into our clients' latest products. Clients increasingly rely on Richtek's proprietary design-in services in order to integrate advanced power management technologies into products facing tighter and tighter development schedules. These solutions have already made Richtek the world's largest supplier of power management ICs for desktop computer mainboards, as well as a leading provider of power management chips used in handsets, digital still cameras, network communications equipment, large-sized flat panel displays, notebooks, and much more. For more details, please visit www.Richtek.com
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the U.S.A., plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.