Contact Information: Media Contacts: Susan Cain Cain Communications for Sidense Tel: 503-538-2747 Email: Jim Lipman Sidense Tel: 925-606-1370 Email:
Jim Lipman Joins Logic NVM Pioneer Sidense as Marketing Director
Industry Veteran's Semiconductor Industry and IP Experience Will Enhance Spread of Embedded Non-Volatile Memory in Many Digital and Analog Applications
| Source: Sidense
OTTAWA--(Marketwire - February 19, 2008) - Sidense, a leading developer of Logic Non-Volatile
Memory (NVM) IP cores, today announced the appointment of Jim Lipman as its
Director of Marketing. Dr. Lipman will report to CEO and President Xerxes
Wania and be responsible for Sidense's worldwide marketing activities as
the company continues to expand its product offerings and customer base.
"I have worked with Jim for the past year and am happy he decided to join
the Sidense team," said Xerxes Wania. "Jim has tremendous industry
experience and contacts and will be a key contributor as we extend our
business and technology leadership position."
Dr. Lipman was most recently Vice President of Client Services at Cain
Communications. His prior experience, focusing on semiconductors, EDA
tools and semiconductor IP, spans management positions in design, marketing
and public relations at many well known companies, including TechOnLine,
VLSI Technology, Hewlett-Packard and Texas Instruments. Dr. Lipman holds a
Doctor of Engineering degree from Southern Methodist University and an MBA
from Golden Gate University.
"I am very pleased to join a company such as Sidense with their industry
leading non-volatile memory technology and products," said Dr. Lipman. "I
appreciate the opportunity to be part of the Sidense team as we continue to
explore and identify new opportunities for our low cost and highly secure
embedded memory IP for a broad range of applications."
About Sidense
Sidense, listed on EE Times 60 Emerging Startups list for 2008, provides
secure, dense and reliable non-volatile, one-time programmable (OTP) memory
IP for use in standard-logic CMOS processes, with no additional masks or
process steps required. Sidense's patented one-transistor 1T-Fuse™
architecture provides the industry's smallest footprint and lowest power
Logic Non-Volatile Memory (NVM) solution.
Sidense OTP memory is available at 180nm, 130nm, 90nm and 65nm and scalable
to 45nm and below. The IP is available at UMC, TSMC, SMIC, Tower and
Chartered. Customers are using Sidense OTP for analog trimming, code
storage, encryption keys such as HDCP, RFID and Chip ID, medical,
automotive, and configurable processors and logic. For more information,
visit www.sidense.com.