Contact Information: Investor Relations Contact: Tham Kah Locke Vice President of Corporate Finance Tel: (65) 6824 7788 Fax: (65) 6720 7826 email: Media Contacts: Lisa Lavin Deputy Director of Corporate Communications Tel: (208) 867-9859 email: Mike Brozda Intersil Corporation Tel: (408) 546-3315 email:
STATS ChipPAC Receives Intersil's Supplier of the Year Award
| Source: STATS ChipPAC
SINGAPORE -- 1/15/2010, UNITED STATES--(Marketwire - January 14, 2010) - STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced that
it was recently named "Supplier of the Year" by Intersil Corporation
(NASDAQ : ISIL ), a world leader in the design and manufacture of
high-performance analog and mixed-signal semiconductors.
This award marks the first time that Intersil has recognized a top supplier
for their company. STATS ChipPAC was selected from among all of Intersil's
wafer foundry and assembly and test suppliers. STATS ChipPAC provides full
turnkey assembly and test services for Intersil's analog solutions.
"We congratulate STATS ChipPAC on their strong operational performance and
appreciate their exceptional service to Intersil. Their technology
leadership, engineering support, quality mindset and sharp focus on
providing high-performance, low-cost solutions have helped Intersil to
accelerate our time-to-market for new products and grow our business," said
Sagar Pushpala, Senior Vice President of Operations and Technology,
Intersil.
"We are truly honored to receive the first Supplier of the Year award from
Intersil, one of the premier high-performance analog companies in the
semiconductor industry. We have been pleased to work with Intersil on a
number of technology and manufacturing initiatives and believe this award
speaks highly of the success we have achieved and the partnership that has
developed between our two companies," said Lew Hon Sang, Managing Director
of STATS ChipPAC's manufacturing facilities in Malaysia and Singapore.
Forward-Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release.
Factors that could cause actual results to differ include, but are not
limited to, deterioration in general business and economic conditions and
the state of the semiconductor industry; prevailing market conditions;
demand for end-use applications products such as communications equipment,
consumer and multi-applications and personal computers; decisions by
customers to discontinue outsourcing of test and packaging services; level
of competition; our reliance on a small group of principal customers; our
continued success in technological innovations; customer credit risks;
possible future application of push-down accounting; pricing pressures,
including declines in average selling prices; intellectual property rights
disputes and litigation; our ability to control operating expenses; our
substantial level of indebtedness and access to credit markets; our ability
to generate cash; potential impairment charges; availability of financing;
adverse tax and other financial consequences if the taxing authorities do
not agree with our interpretation of the applicable tax laws; our ability
to meet specific conditions imposed for the continued listing or delisting
of our ordinary shares on the Singapore Exchange Securities Trading Limited
(SGX-ST); classification of the Company as a passive foreign investment
company; our ability to develop and protect our intellectual property;
rescheduling or canceling of customer orders; changes in our product mix;
our capacity utilization; delays in acquiring or installing new equipment;
limitations imposed by our financing arrangements which may limit our
ability to maintain and grow our business; returns from research and
development investments; changes in customer order patterns; shortages in
supply of key components; disruption of our operations; loss of key
management or other personnel; defects or malfunctions in our testing
equipment or packages; changes in environmental laws and regulations;
exchange rate fluctuations; regulatory approvals for further investments in
our subsidiaries; majority ownership by Temasek Holdings (Private) Limited
("Temasek") that may result in conflicting interests with Temasek and our
affiliates; unsuccessful acquisitions and investments in other companies
and businesses; labor union problems in South Korea; uncertainties of
conducting business in China and changes in laws, currency policy and
political instability in other countries in Asia; natural calamities and
disasters, including outbreaks of epidemics and communicable diseases; and
other risks described from time to time in the Company's filings with the
U.S. Securities and Exchange Commission, including its annual report on
Form 20-F dated March 9, 2009. You should not unduly rely on such
statements. We do not intend, and do not assume any obligation, to update
any forward-looking statements to reflect subsequent events or
circumstances.
About Intersil
Intersil Corporation
("Intersil") is a leader in the design and manufacture of high-performance
analog and mixed signal semiconductors. Intersil's products address some of
the industry's fastest growing markets, such as flat panel displays, cell
phones, notebooks and other handheld systems. Intersil's product families
address power management functions and analog signal processing functions.
Intersil products include ICs for battery
management, hot-plug controllers, linear regulators, power sequencers,
supervisory ICs, bridge drivers, PWM
controllers, switching DC/DC regulators, Zilker Labs Digital Power ICs
and power MOSFET drivers; optical storage laser diode drivers; DSL line
drivers; D2Audio products; video and high-performance operational amplifiers; high-speed data converters;
interface ICs; analog
switches and multiplexers; crosspoint switches; voice-over-IP devices;
and ICs for military,
space and radiation-hardened applications. For more information about
Intersil or to find out how to become a member of our winning team, visit
Intersil's web site and career page at www.intersil.com.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices in 10 different
countries. STATS ChipPAC is listed on the SGX-ST. Further information is
available at www.statschippac.com. Information contained in this website
does not constitute a part of this release.