ALLVIA to Sponsor and Exhibit Silicon Interposers at Packaging Conference ECTC 2012 in San Diego

SUNNYVALE, CA--(Marketwire - May 29, 2012) - ALLVIA, the first through-silicon via (TSV) foundry, will sponsor ECTC (Electronic Components and Technology Conference) and display its latest analysis on silicon interposers and embedded capacitors. The 62^nd ECTC conference takes place May 29 to June 1, 2012, at the Sheraton Hotel and Marina in San Diego, California. ALLVIA will discuss its current data results at its booth in the adjacent exhibit hall.

Silicon interposers are being used in 3D stacked assembly applications for an increasing variety of reasons, such as reduced costs. The inclusion of an interposer opens up the option of fabricating capacitors closer to the devices they need to protect. ALLVIA has recently presented results of tests and developments they have completed on planar and trench capacitors on interposers. Test results up to 6 GHz have been detailed along with reliability results.

Through-Silicon Vias/Embedded Capacitors
Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.

ECTC
This year's packaging technology conference will have 39 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. Registration is open online at www.ectc.net.

About ALLVIA
Located in Silicon Valley, ALLVIA is the first through-silicon via (TSV) foundry and introduced the term "through-silicon via" in both a 1997 business plan and a January 2000 technical article. With the full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc. www.allvia.com